Megarobo develops and produces high-end intelligent superconductor-dicing machines, which can be widely used in various semiconductor product processing scenarios such as wafers, ceramics, silicon wafers, glass, PCB, lithium niobate, alumina, and quartz. We have semi-automatic single-spindle dicing machine MDS-DS3350 and the fully automatic dual-spindle dicing machine MDS-DS6360 series as products. All series can be equipped with NCS (non-contact surveying) function, BBD (Blade broken detection) function, and blade mark detection function. The automatic series can be equipped with UV de-glue system and cleaning system.（Wafer Thinning,Bonding，dicing saw）
Dicing Saws Product Description:
- Designed according to international standards and world-class high-precision
- World popular round size: 8 inch + 12 inch machine structure and working interface are designed according to world's popular machine;
- Designed with high-end imported materials, such as imported C3 ball screw and Renishaw grating ruler closed-loop control system, which can reach the world level
- Equipped with roller guides, whose life stability is 8 times higher than that of balls
- The fuselage is made of Jinan blue marble that has been treated for hundreds of millions of years, and it will never be deformed.
Dicing Saws Key Ponints:
1. Accuracy: In terms of non-contact detection, the accuracy of other product is 2um but our product is 1.2um, and our software system can accurately locate the cutting position.
2. Stability: In terms of the walking straightness of the workbench, other product is less than 2um linear deviation in 300mm stroke (not promised), but our product is less than 1.5um linear deviation in 480mm stroke, and we clearly promise that deviation could be less than 2um linear in 305mm stroke. Our fuselage adopts China's unique Taishan blue marble structure and special heat treatment technology for aging treatment, which is not easy to deform.
3. Compatibility of the machine to the product: our equipment can cut 8-inch and 12-inch wafers at the same time, but other equipment need to cut the 8-inch and 12-inch wafers separately, which increases the user's replacement cost and waiting time. Our parts are highly versatile and easier to maintain.
4. Service life: our company's equipment adopts a unique roller guide structure, and the equipment of other company adopts ball guide. The life and stability of the roller guide structure are 8 times higher than that of ball guide.
5. Short delivery time: our company has an automated production line and a sophisticated production team, and maintains a good mutual trust cooperation relationship with major domestic and foreign suppliers, so that the delivery cycle to customers can be maintained within 3 months , generally 1-2 months.
About Wafer Dicing Saws
A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.
The founding team of MegaRobo has over 10 years of industry background for industrial automation. At present, the team has more than 350 people. Driven by independent research and development and technology innovation, MegaRobo has accumulated a number of core technologies with world competitiveness and applied for over 150 invention patents. It co-built the laboratory with Beijing Jiaotong University and Xidian University, and its products have passed ISO9001 Quality Management System Certification. The clients include many well-known enterprises in the industry, such as BGI, Berrygenomics, Wuxi AppTec, RoboCup, Greenland Deepblue, Tesla, Ford, Sinopec, China Aerospace, etc
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